Wafer size | ø200mm~300mm |
---|---|
Microscope (micro) inspection | |
Total magnification | 25x to 1,500x |
Inspection modes | Brightfield, darkfield, 3D Laser Scanning (Option) |
Autofocus | Laser AF or Illumination slit projection |
Macro inspection | Surface Macro, backside Macro Halogen Spotlight illumination |
Macro inspection illumination | Halogen Spotlight & UV 형광 illumination illumination |
Load port | 1 FOUP (or 1 FOSB: option) Position selectable from front, side or rear |
Wafer transfer | Robotic handling; vacuum chuck; noncontact pre-alignment mechanism |
WAFER ALIGNMENT | Non-contact Centering |
Operation | Touch panel GUI, mouse, keyboard |
UPH | 50-60WPH |
Power | 220VAC, 50/60HZ, 10A |
Compressed Air | 4.5kgf/cm2 dry air, 50 litre / minute |
Laser 3D Microscope | Magnification : -108x-17,280x |
---|---|
Height, Width, Roughness Measurment | |
Pattern Auto Capture | |
Auto Review inspection System | Auto Stage moving ( Recipe Mode) |
Pattern Auto Capture | |
Auto Measurment | |
IR inspection System | 웨이퍼 레벨 CSP의 비파괴 검사 |
융합 or구리 배선의 부식에 의한 누출과 수지의 peeling검사 | |
WAFER ID READER | OCR: IBM font, Triple font, SEMI font (SEMI M12, M13 & M1.15) |
2D Data Matrix ( ECC200, 8x32 ): SEMI T7, M1.15 | |
Barcode : IBM412 & BC412 (SEMI T1-95) | |
ULPA boronless FFU (fan filter unit) | Option |
HOST INTERFACE OR SECS-GEM CAPABILITY | Option |
Wafer size | Magnification : -108x-17,280x |
---|---|
Height, Width, Roughness Measurment | |
Pattern Auto Capture | |
Wafer cassette | Auto Stage moving ( Recipe Mode) |
IR inspection System | 웨이퍼 레벨 CSP의 비파괴 검사 |
융합 or구리 배선의 부식에 의한 누출과 수지의 peeling검사 | |
Wafer ID Reader | OCR: IBM font, Triple font, SEMI font (SEMI M12, M13 & M1.15) |
2D Data Matrix ( ECC200, 8x32 ): SEMI T7, M1.15 | |
Barcode : IBM412 & BC412 (SEMI T1-95) | |
ULPA boronless FFU (fan filter unit) | Option |
HOST INTERFACE OR SECS-GEM CAPABILITY | Option |
UPH | 400 wafers |
1750 x 1750 x 2000 mm | |
Power | 220VAC, 50/60HZ, 10A |
4.5kgf/cm2 dry air, 50 litre / minute | |
Approximately 800kg |